Abstract
Today, traditional packaging technologies still play important roles for most of the ICs, MEMS, and sensors due to the advantages of low cost, good reliability, and huge production capacity. Continuous innovations of these technologies are driven by new applications such as 5G, automotive, IoT applications, etc. In this chapter, the main processes of traditional packaging such as wafer thinning, wafer dicing, die-attach, wire bonding, molding, plating are introduced. Then the structures, processes, developing trend, and applications for several typical traditional packaging technologies, i.e., SOP (small outline package), QFN (Quad flat no-lead package), WB-BGA (wire bond ball grid array), Metal Packaging, and Ceramic Packaging are explained and discussed.
This is a preview of subscription content, log in via an institution to check access.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
References
T. Wang, Y. Wang, et al., Die Attaching Process and Equipment (Publishing House of Electronics Industry, Beijing, 2008)
K. Bi, Microelectronics Technology (National Defence Industry Press, Beijing, 2008)
T. Minbo, Electronic Packaging Engineering (Tsinghua University Press, Beijing, 2003)
R. Tummala, E.J. Rymaszwski, A.G. Klopfenstein, Microelectronics Packaging Handbook, 2nd edn. (Publishing House of Electronics Industry, Beijing, 2001)
P.S. Chauhan, A. Choubey, Z.W. Zhong, et al., Copper Wire Bonding [M] (Springer, New York, 2014)
Z. Mao, J. Pan, Z. Yuan, 1C Packaging Foundation And engineering Design Examples (Electronic industry press, Beijing, 2014)
The General Reserve Department of PLA, Test methods and procedures for microelectronics devices: GJB548J3 -- 2005 [S] (Military Standard Publishing and Distribution Department of the General Reserve Department, Beijing, 2007)
Author information
Authors and Affiliations
Corresponding author
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 2024 Publishing House of Electronics Industry
About this entry
Cite this entry
Yu, D., Liu, ZQ., Li, M., Zhu, L., Guo, X. (2024). Key Technologies and Processes for Traditional Packaging. In: Wang, Y., Chi, MH., Lou, J.JC., Chen, CZ. (eds) Handbook of Integrated Circuit Industry. Springer, Singapore. https://doi.org/10.1007/978-981-99-2836-1_56
Download citation
DOI: https://doi.org/10.1007/978-981-99-2836-1_56
Published:
Publisher Name: Springer, Singapore
Print ISBN: 978-981-99-2835-4
Online ISBN: 978-981-99-2836-1
eBook Packages: EngineeringReference Module Computer Science and Engineering