Abstract
Based on the daily work summary and the induction of actual case processing methods, a systematic and hierarchical process verification scheme of BGA solder joints is proposed in the paper. Then the verification scheme is introduced through an actual case. Based on the application examples, the scheme is confirmed to ensure the adequacy of the experimental dates, and the rigorous and accuracy of the conclusion.
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Lu, W., Jin, D., Wan, Y. (2020). Systematic Verification of BGA Solder Joint Reliability in Multiple Ways. In: Duan , B., Umeda, K., Hwang, W. (eds) Proceedings of the Seventh Asia International Symposium on Mechatronics. Lecture Notes in Electrical Engineering, vol 589. Springer, Singapore. https://doi.org/10.1007/978-981-32-9441-7_97
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DOI: https://doi.org/10.1007/978-981-32-9441-7_97
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Online ISBN: 978-981-32-9441-7
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