Abstract
Packaging technologies have gone through a remarkable evolution since their first use in ancient Egypt. Among the diverse variety of materials available, polymers are commonly used to fabricate food packaging. The widespread use of polymers in packaging is due to their availability in large quantities, cost-effectiveness, attractive mechanical performance, and tunable barrier to gases and other volatile odorous compounds. The emerging surface engineering technologies such as mechanical patterning of the polymer surfaces, exposure to high energy radiations, wet chemical and light-induced surface chemical modifications, and nanoparticle application are revolutionizing the polymer-based food packaging industry. Both decorative and functional aspects of packaging encompass these surface engineering technologies, thus preserving the quality and prolonging life span of the packaged food. The polymer-based packaging protects food from spoilage by providing a shield against microbial and chemical toxins, temperature change, oxygen, humidity, light, and external physical forces. Recent innovations in food packaging have introduced new concepts of active, intelligent, and smart packaging. The concomitant developments in stimuli-responsive materials is enabling the advancements in packaging technologies by driving the growth in functional polymeric nanocomposites, nanomaterial-based coatings, electrospun functional material, and nano(bio)sensors. This chapter covers the recent advances in the surface engineering technologies that are at the heart of the development of polymer-based food packaging for the future.
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Acknowledgments
B.Y. acknowledges support from HFSP (RGY0074/2016), HEC for NRPU (Project No. 20-1740/R&D/10/3368, 20-1799/R&D/10-5302 and 5922), TDF-033 grants, and LUMS for start-up fund and FIF grants.
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Azeem, I., Ashfaq, B., Sohail, M., Yameen, B. (2022). Polymer Surface Engineering in the Food Packaging Industry. In: Pandey, L.M., Hasan, A. (eds) Nanoscale Engineering of Biomaterials: Properties and Applications . Springer, Singapore. https://doi.org/10.1007/978-981-16-3667-7_16
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