Abstract
In this chapter, we present an industrial nondestructive technique to can identify and localize geometrical microscopic defects in a silver microstrip line. We worked on two types of defects: the narrow transverse slits and the overflows. It is true that there are several techniques to detect defects on the microstrip line, but these techniques can be destructive and do not allow us to localize and characterize the defect like the measure of the impedance or to identify the defect when the type of defect is unknown like the reflectometry. The proposed technique is based on the measure of the scatting parameters, the calculation of the characteristic impedance of each model of the microstrip line (undamaged and defective), and the comparison between the different results obtained from the practical and the theoretical tests.
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Acknowledgements
This work is a part of a project proposed by the company APEM-SACELEC. A special thanks to Sys’Com, laboratory of ENIT, and ENSTA for their collaboration.
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Troudi, L., Jelassi, K., Sellaouti, M. (2020). A Nondestructive Technique to Identify and Localize Microscopic Defects on a Microstrip Line. In: Derbel, N., Ghommam, J., Zhu, Q. (eds) Diagnosis, Fault Detection & Tolerant Control. Studies in Systems, Decision and Control, vol 269. Springer, Singapore. https://doi.org/10.1007/978-981-15-1746-4_1
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DOI: https://doi.org/10.1007/978-981-15-1746-4_1
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