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Fan-in Wafer-Level Packaging Versus FOWLP

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Fan-Out Wafer-Level Packaging

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Abstract

Fan-in wafer-level packaging (WLP) technology will be discussed in this chapter. A wafer-level chip scale package (WLCSP) will be designed and fabricated, and then assembled on a printed circuit board (PCB). Emphasis is placed on the key process steps in making the redistribution layer (RDL) of the WLCSP and its PCB solder joint reliability.

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Authors and Affiliations

  1. ASM Pacific Technology, Hong Kong, New Territories, Hong Kong

    John H. Lau

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  1. John H. Lau
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Correspondence to John H. Lau .

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Lau, J.H. (2018). Fan-in Wafer-Level Packaging Versus FOWLP. In: Fan-Out Wafer-Level Packaging. Springer, Singapore. https://doi.org/10.1007/978-981-10-8884-1_3

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  • DOI: https://doi.org/10.1007/978-981-10-8884-1_3

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  • Publisher Name: Springer, Singapore

  • Print ISBN: 978-981-10-8883-4

  • Online ISBN: 978-981-10-8884-1

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