Abstract
A micropump using bubble motion in microchannel is fabricated and tested. In order to pursue the lowest power consumption, this pump makes use of the remaining heat of any hot part. Pumping pressure of 140Pa at stable operation is obtained and several future schemes for further improvement are discussed.
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References
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© 2002 Springer Science+Business Media Dordrecht
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Takahashi, K., Ikeda, H., Ikuta, T., Nagayama, K., Asano, T. (2002). Thermal Micropump Using Surface Tension Imbalance in Microchannels. In: Baba, Y., Shoji, S., van den Berg, A. (eds) Micro Total Analysis Systems 2002. Springer, Dordrecht. https://doi.org/10.1007/978-94-010-0295-0_43
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DOI: https://doi.org/10.1007/978-94-010-0295-0_43
Publisher Name: Springer, Dordrecht
Print ISBN: 978-94-010-3952-9
Online ISBN: 978-94-010-0295-0
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