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Precise and Feasible Fabrication Process of Microfluidic Devices on a Borosilicate Glass Chip

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Micro Total Analysis Systems 2002

Abstract

In order to establish the feasible and reliable fabrication process of high-precision microfluidic devices on borosilicate glass (Corning #7740) substrates, deep dry etching technology of borosilicate glass using high density plasmas and the rapid bonding method of glass plates using modified anodic bonding have been studied.

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References

  1. T. Ujiie, T. Kikuchi, T. Ichiki and Y. Horiike, Jpn. J. Appl. Phys. 39, 3677–3682 (2000)

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  2. X. Li, T. Abe and M. Esashi, Proc. of Micro Electro Mechanical Systems 2000, Miyazaki, Japan (2000) p 271.

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  3. T. Ichiki, Y. Sugiyama and Y Horiike, Proc. 23rd Int. Symp. on Dry Process, Tokyo, Japan (2001) pp. 63–68.

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© 2002 Springer Science+Business Media Dordrecht

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Sugiyama, Y., Otsu, Y., Ichiki, T., Horiike, Y. (2002). Precise and Feasible Fabrication Process of Microfluidic Devices on a Borosilicate Glass Chip. In: Baba, Y., Shoji, S., van den Berg, A. (eds) Micro Total Analysis Systems 2002. Springer, Dordrecht. https://doi.org/10.1007/978-94-010-0295-0_39

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  • DOI: https://doi.org/10.1007/978-94-010-0295-0_39

  • Publisher Name: Springer, Dordrecht

  • Print ISBN: 978-94-010-3952-9

  • Online ISBN: 978-94-010-0295-0

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