Abstract
In order to establish the feasible and reliable fabrication process of high-precision microfluidic devices on borosilicate glass (Corning #7740) substrates, deep dry etching technology of borosilicate glass using high density plasmas and the rapid bonding method of glass plates using modified anodic bonding have been studied.
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References
T. Ujiie, T. Kikuchi, T. Ichiki and Y. Horiike, Jpn. J. Appl. Phys. 39, 3677–3682 (2000)
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T. Ichiki, Y. Sugiyama and Y Horiike, Proc. 23rd Int. Symp. on Dry Process, Tokyo, Japan (2001) pp. 63–68.
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© 2002 Springer Science+Business Media Dordrecht
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Sugiyama, Y., Otsu, Y., Ichiki, T., Horiike, Y. (2002). Precise and Feasible Fabrication Process of Microfluidic Devices on a Borosilicate Glass Chip. In: Baba, Y., Shoji, S., van den Berg, A. (eds) Micro Total Analysis Systems 2002. Springer, Dordrecht. https://doi.org/10.1007/978-94-010-0295-0_39
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DOI: https://doi.org/10.1007/978-94-010-0295-0_39
Publisher Name: Springer, Dordrecht
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