Summary
A compatible set of advanced interconnect technologies has been developed and used in the construction of high density, high speed multichip modules. The two key interconnect technologies which have been developed are tape automated bonding (TAB) to 125 um pitch and > 200 l/Os, and an additive multilayer board technology on a pcb base, with stripline signal layers suitable for GHz signals. All signal layers in this board technology have a 125 um pitch capability. Using the associated mechanical, electrical and thermal design tools that had been developed, these interconnect technologies have been proven in both high density (silicon to substrate ratio 36%) and high speed (>600 Mbit/s) multichip modules.
This is a preview of subscription content, log in via an institution to check access.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
Preview
Unable to display preview. Download preview PDF.
Similar content being viewed by others
References
R. P. Arrowsmith, N. Chandler, G. Dehaine, K. Kurzweil, “High Performance VLSI Interconnection Systems”, Proc. 4th Annual ESPRIT Conference, Brussels, September 1987.
G. Dehaine, K. Kurzweil, “Tape Automated Bonding Moving into Production”, Solid State Technology, October 1985.
Author information
Authors and Affiliations
Editor information
Rights and permissions
Copyright information
© 1989 ECSC, EEC, EAEC, Brussels and Luxembourg
About this paper
Cite this paper
Dehaine, G., Kurzweil, K., Arrowsmith, R., Small, D., Chandler, N., Tyler, S. (1989). Multichip Packages in the Esprit Programme. In: Esprit ’89. Springer, Dordrecht. https://doi.org/10.1007/978-94-009-1063-8_13
Download citation
DOI: https://doi.org/10.1007/978-94-009-1063-8_13
Publisher Name: Springer, Dordrecht
Print ISBN: 978-94-010-6968-7
Online ISBN: 978-94-009-1063-8
eBook Packages: Springer Book Archive