Abstract
The Bi-2212/Ag tapes with nominal composition of Bi2Sr2.05Ca0.95Cu2Ox and Bi2Sr2.05Ca0.95Cu2Ox have been prepared by PAIR process and melt-solidification process in the atmosphere of oxygen and air. The result shows the starting composition and treating atmosphere, mainly affecting on the amount of extra phases (Bi-free, Cu-free phases), play an important role in the microstructure and Jc of the tapes. In treating in pure oxygen, the reduction of extra phases and highest Jc of over 5.0 × 105 A/cm2 at 4.2 K, 10 T is obtained in Bi2Sr2.05Ca0.95Cu2Ox/Ag tape, while in treating in air, reduction of extra phases and higher Jc of 4.0 × 105 A/cm2 is obtained in Bi2Sr2.05Ca0.95Cu2Ox/Ag tape than Bi2Sr2.05Ca0.95Cu2Ox/Ag tape.
Preview
Unable to display preview. Download preview PDF.
Similar content being viewed by others
Reference
Hasegawa T, Hikichi Y, Kumakura H, Kitaguchi H, Togano K (1995) Jpn J Appl Phys 34: L1638–1642.
Kase J, Morimoto T, Togano K, Kumakura H, Dietderich DR, Maeda H (1991) IEEE Trans Magn 27: 1254–1257.
Kumakura H, Kitaguchi H, Togano K, Sugiyama N (1996) J Appl Phys 80: 5162–5169.
Miao H, Kitaguchi H, Kumakura H, Togano K (1998) Cryogenics 38: 257–261.
Miao H, Kitaguchi H, Kumakura H, Togano K, Hasegawa T (1998) Physica C 301: 116–122
Miao H, Kitaguchi H, Kumakura H, Togano K, Hasegawa T, Koizumi T (1998) Physica C 303: 81–90.
Hasegawa T, Hikichi Y, Kumakura H, Kitaguchi H, Togano K (1994) Advances in Superconductivity VI: 707–710.
Author information
Authors and Affiliations
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 1999 Springer Japan
About this paper
Cite this paper
Miao, H., Kitaguchi, H., Kumakura, H., Togano, K., Hasegawa, T., Koizumi, T. (1999). Effects of Starting Composition and Treating Atmosphere on Phase formation, Microstructure and Jc of Bi2Sr2CaCu2Ox/Ag Multilayer Tapes. In: Koshizuka, N., Tajima, S. (eds) Advances in Superconductivity XI. Springer, Tokyo. https://doi.org/10.1007/978-4-431-66874-9_208
Download citation
DOI: https://doi.org/10.1007/978-4-431-66874-9_208
Publisher Name: Springer, Tokyo
Print ISBN: 978-4-431-66876-3
Online ISBN: 978-4-431-66874-9
eBook Packages: Springer Book Archive