Abstract
As interconnection densities continue to increase in response to the drive for faster, smaller and more complex electronic systems, greater demands are being placed on multilayer PCB technology than ever before. More layers are being used and trace geometries are shrinking. As a consequence, contaminants on inner-layer conductors are more likely to hinder the formation of reliable interconnections.
This is a preview of subscription content, log in via an institution to check access.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
Preview
Unable to display preview. Download preview PDF.
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 1984 Springer-Verlag Berlin Heidelberg
About this chapter
Cite this chapter
Dixon, T. (1984). Plasma Desmearing. In: Riley, F. (eds) The Electronics Assembly Handbook. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-662-13161-9_8
Download citation
DOI: https://doi.org/10.1007/978-3-662-13161-9_8
Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-662-13163-3
Online ISBN: 978-3-662-13161-9
eBook Packages: Springer Book Archive