Abstract
The trend in hybrid microelectronics packaging technology is toward greater sophistication and greater density. Most hybrid circuit manufacturing facilities have adopted a somewhat ‘standard’ manufacturing technology, such as chip-and-wire, which is used to fabricate a variety of circuit types.
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© 1988 Springer-Verlag Berlin Heidelberg
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Sergent, J.E., Chiles, H.H., Power, R. (1988). Test and Inspection of Hybrid Microcircuits. In: Riley, F. (eds) The Electronics Assembly Handbook. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-662-13161-9_66
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DOI: https://doi.org/10.1007/978-3-662-13161-9_66
Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-662-13163-3
Online ISBN: 978-3-662-13161-9
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