Abstract
Several of the concerns for those involved in surface-mount technology include soldering, cost, component availability, component standards and product reliability through testing. The current methods of attaching surface-mount devices to pads require special attention because of the high temperatures associated with the soldering process. The cost of individual surface-mount components is higher than their conventional component counterparts. And there is the cost of new SMD board-assembly equipment, too. Furthermore, only 10-15% of the leaded-type components are available in the SMD format, and if that is not enough, there are currently different dimensional characteristics between similar US, Japanese and European manufactured parts.
This is a preview of subscription content, log in via an institution to check access.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
Preview
Unable to display preview. Download preview PDF.
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 1988 Springer-Verlag Berlin Heidelberg
About this chapter
Cite this chapter
Tygard, C.M. (1988). Probe Design and Test Fixturing. In: Riley, F. (eds) The Electronics Assembly Handbook. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-662-13161-9_62
Download citation
DOI: https://doi.org/10.1007/978-3-662-13161-9_62
Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-662-13163-3
Online ISBN: 978-3-662-13161-9
eBook Packages: Springer Book Archive