Abstract
Solder coating of bare-board circuitry, followed by a leveling operation to clear the component holes and remove excess solder, is a PCB fabrication technique which offers major benefits to the user. These include such technical advantages as improved board solderability through the formation of a thick coating of eutectic solder on pads and plated holes, improvement in the product’s appearance and an extended shelf life. Coating and leveling, as a process, has become closely associated in recent years with the application of solder mask over bare copper (MOBC) to prevent solder bridging under solder mask and wicking through PCB component holes.
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© 1985 Springer-Verlag Berlin Heidelberg
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Keeler, R. (1985). Solder Coating and Leveling. In: Riley, F. (eds) The Electronics Assembly Handbook. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-662-13161-9_49
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DOI: https://doi.org/10.1007/978-3-662-13161-9_49
Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-662-13163-3
Online ISBN: 978-3-662-13161-9
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