Abstract
Solder paste may not be familiar turf, even now, for some amid substantial changes that loom with the anticipated surface-mount technology revolution. Undaunted, some manufacturers of electrical-conductive epoxy, following on their success in hybrid and IC die attach, are looking to replace solder paste with conductive epoxy for attachment of surface-mount components to PCBs.
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© 1986 Springer-Verlag Berlin Heidelberg
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Pound, R. (1986). Conductive Epoxy for SMT Solder Replacement. In: Riley, F. (eds) The Electronics Assembly Handbook. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-662-13161-9_34
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DOI: https://doi.org/10.1007/978-3-662-13161-9_34
Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-662-13163-3
Online ISBN: 978-3-662-13161-9
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