Surface-Mount Assembly Using Machine Vision

Abstract

Successful surface-mount pick-and-place depends on a number of operations orchestrated in such a manner as to ensure an end product, often manufactured in large volume, which functionally and cosmetically conforms to rigid specifications. Solder paste or adhesive is first laid down on the circuit board, or sometimes on the component itself, the surface-mount device is picked from its container and placed precisely at its predetermined address, and the assembly, with parts tenuously secured by viscous paste or glue, is soldered to provide permanent electrical and mechanical bonding. Prior to soldering, an inspection process verifies placement; while following final assembly, test assures functionality. Equally important are cleaning operations and through-hole insertion for mixed-technology boards.