Abstract
Surface-mount technology (SMT) is an old technology that has suddenly captured the limelight in electronics manufacturing. Its beginnings can be traced back to over 20 years ago when chip resistors and capacitors were first soldered to thick-film hybrid circuits on ceramic substrates. Today, SMT’s popularity has been accelerated by the development of the chip carrier, the availability of small outline (SO and SOT) semiconductor device packages, a widening choice of automated production equipment, and the major driving force: the requirement for higher density packaging.
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© 1985 Springer-Verlag Berlin Heidelberg
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Markstein, H.W. (1985). SMT Advantages. In: Riley, F. (eds) The Electronics Assembly Handbook. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-662-13161-9_28
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DOI: https://doi.org/10.1007/978-3-662-13161-9_28
Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-662-13163-3
Online ISBN: 978-3-662-13161-9
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