Summary
This paper describes a new wafer-level packaging technique in which the vacuum cavity is created using silicon-glass bonding and is subsequently sealed using localized polysilicon CVD. This allows cavity evacuation after bonding and sealing with the chip near ambient temperature. The cavity pressure is measured by monitoring the quality factor (Q) of an embedded comb resonator and can be adjusted as needed using an active getter. Measured Qs of ∼2300 indicate that cavity pressures below 50mTorr have been achieved.
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© 2001 Springer-Verlag Berlin Heidelberg
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Chang-Chien, P.P.L., Wise, K.D. (2001). Wafer-Level Packaging Using Localized Mass Deposition. In: Obermeier, E. (eds) Transducers ’01 Eurosensors XV. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-59497-7_42
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DOI: https://doi.org/10.1007/978-3-642-59497-7_42
Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-540-42150-4
Online ISBN: 978-3-642-59497-7
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