Skip to main content

Simultaneous Temperature and Deformations Measurements Using Long-Wave Infrared Speckle Interferometry: A Novel Hybrid Technique for Industrial Nondestructive Testing

  • Conference paper
Fringe 2013

Introduction

Since its demonstration in 2003 [1], the use of long-wave infrared (LWIR) CO2 lasers in Digital Holography (DH) has been shown in an increasing number of applications. In particular it allows observing large objects and in metrology it allows measuring large displacements while rendering holography more immune to environmental perturbations, compared to holography in the visible. For metrology we demonstrated various holographic techniques in LWIR: speckle interferometry [2,4], DH interferometry [2-4] and shearography [4]. The LWIR holographic set-up generally makes use of microbolometer arrays based thermal imagers. The present paper discusses some result of the European project FANTOM in which another advantage was put forward when speckle interferometry is applied in LWIR: the thermal background is captured simultaneously to the specklegrams since it constitutes an offset in the signal. Therefore one can correlate uniquely the temperature and displacement information at the same time and in each pixel. We describe here the successful achievements of the project.

This is a preview of subscription content, log in via an institution to check access.

Access this chapter

Chapter
USD 29.95
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
eBook
USD 259.00
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
Softcover Book
USD 329.99
Price excludes VAT (USA)
  • Compact, lightweight edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info
Hardcover Book
USD 329.99
Price excludes VAT (USA)
  • Durable hardcover edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info

Tax calculation will be finalised at checkout

Purchases are for personal use only

Institutional subscriptions

Preview

Unable to display preview. Download preview PDF.

Unable to display preview. Download preview PDF.

Similar content being viewed by others

References

  1. Allaria, E., Brugioni, S., De Nicola, S., Ferraro, P., Grilli, S., Meucci, R.: Digital holography at 10.6 μm. Optics Communication 215, 257–262 (2003)

    Article  Google Scholar 

  2. Vandenrijt, J.-F., Georges, M.P.: Electronic speckle pattern interferometry and digital holographic interferometry with microbolometer arrays at 10.6μm. Applied Optics 49(27), 5067–5075 (2010)

    Article  Google Scholar 

  3. Alexeenko, I., Vandenrijt, J.-F., Georges, M.P., Pedrini, G., Cédric, T., Osten, W., Vollheim, B.: Digital holographic interferometry by using long wave infrared radiation (CO2 Laser). Applied Mechanics and Materials 24-25, 147–152 (2010)

    Google Scholar 

  4. Alexeenko, I., Vandenrijt, J.-F., Pedrini, G., Thizy, C., Vollheim, B., Osten, W., Georges, M.P.: Nondestructive testing by using long-wave infrared interferometric techniques with CO2 lasers and microbolometer arrays. Applied Optics 52(1), A56–A67 (2013)

    Google Scholar 

  5. Vandenrijt, J.-F., Thizy, C., Alexeenko, I., Pedrini, G., Rochet, J., Vollheim, B., Jorge, I., Venegas, P., Lopez, I., Osten, W., Georges, M.P.: Mobile speckle interferometer in the long-wave infrared for aeronautical nondestructive testing in field conditions. Optical Engineering 52(10), 101903 (2013)

    Article  Google Scholar 

Download references

Author information

Authors and Affiliations

Authors

Editor information

Editors and Affiliations

Rights and permissions

Reprints and permissions

Copyright information

© 2014 Springer-Verlag Berlin Heidelberg

About this paper

Cite this paper

Georges, M. et al. (2014). Simultaneous Temperature and Deformations Measurements Using Long-Wave Infrared Speckle Interferometry: A Novel Hybrid Technique for Industrial Nondestructive Testing. In: Osten, W. (eds) Fringe 2013. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-36359-7_172

Download citation

  • DOI: https://doi.org/10.1007/978-3-642-36359-7_172

  • Publisher Name: Springer, Berlin, Heidelberg

  • Print ISBN: 978-3-642-36358-0

  • Online ISBN: 978-3-642-36359-7

  • eBook Packages: EngineeringEngineering (R0)

Publish with us

Policies and ethics