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System Integration by Advanced Electronics Packaging

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Bio and Nano Packaging Techniques for Electron Devices

Abstract

This chapter presents a review of the status and the trends of system integration by electronics packaging. At first an analysis of the system drivers will be given and the requirements for System in Package (SiP), followed up by More-than-Moore approaches leading to Hetero-System-Integration. One focus of this chapter will lie on the three-dimensional (3D) integration in electronic packages, their assembly and interconnection technologies. This type of system integration has significant advantages for higher density of functions, smaller sizes and higher clock rates. A second focus of this chapter is directed towards challenges for materials of advanced electronics packaging.

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Authors and Affiliations

  1. Electronic Packaging Laboratory, Technische Universität Dresden, 01062, Dresden, Germany

    Klaus-Jürgen Wolter

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  1. Klaus-Jürgen Wolter
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Correspondence to Klaus-Jürgen Wolter .

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Editors and Affiliations

  1. Fak. Elektrotechnik, Inst. Festkörperelektronik, TU Dresden, Helmholtzstr. 18, Dresden, 01069, Sachsen, Germany

    Gerald Gerlach

  2. Fak. Elektrotechnik und, Informationstechnik, TU Dresden, Mommsenstr. 13, Dresden, 01069, Sachsen, Germany

    Klaus-Jürgen Wolter

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Wolter, KJ. (2012). System Integration by Advanced Electronics Packaging. In: Gerlach, G., Wolter, KJ. (eds) Bio and Nano Packaging Techniques for Electron Devices. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-28522-6_2

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