Synonyms
Definitions
Three-dimensional (3D) palmprint stands for the geometric information of the palmprint; it is independent with the illumination, skin color, and palm pose. In 3D palmprint biometrics, the most commonly used information is the depth information of the principal lines and wrinkles and the shape information of the palm surface.
Background
Two-dimensional (2D) palmprint biometrics has been extensively studied and applied due to its high recognition accuracy and low cost. However, 2D images are generated by projective imaging, so they are inherently sensitive to palm pose. Different palm distances and orientations will lead rotation, translation, and scale variations to the generated 2D palmprint image. Besides, after projection, it loses the valuable 3D structure information, such as the depth of the palmprint lines and the curvature distribution of the palm surface. 2D palm image also is sensitive to illumination, since it is generated...
References
Chen H, Bhanu B (2007) Human ear recognition in 3D. IEEE Trans Pattern Anal Mach Intell 29(4):718–737
Fei L, Zhang B, Jia W, Wen J, Zhang D (2020) Feature extraction for 3-D palmprint recognition: a survey. IEEE Trans Instrum Meas 69(3):645–656
Genovese A, Piuri V, Scotti F (2014) Touchless palmprint recognition systems, vol 60. Springer, Cham
Iula A, Savoia AS, Caliano G (2014) An ultrasound technique for 3D palmprint extraction. Sensors Actuators A Phys 212:18–24
Kanhangad V, Kumar A, Zhang D (2010) Contactless and pose invariant biometric identification using hand surface. IEEE Trans Image Process 20(5):1415–1424
Li W, Zhang L, Zhang D (2009) Three dimensional palmprint recognition. In: 2009 IEEE International Conference on Systems, Man and Cybernetics. IEEE, pp 4847–4852
Li W, Zhang D, Zhang L, Lu G, Yan J (2010a) 3-D palmprint recognition with joint line and orientation features. IEEE Trans Syst Man Cybern Part C (Appl Rev) 41(2):274–279
Li W, Zhang L, Zhang D, Lu G, Yan J (2010b) Efficient joint 2D and 3D palmprint matching with alignment refinement. In: 2010 IEEE Computer Society Conference on Computer Vision and Pattern Recognition. IEEE, pp 795–801
Li W, Zhang D, Lu G, Luo N (2011) A novel 3-D palmprint acquisition system. IEEE Trans Syst Man Cybern Part A Syst Hum 42(2):443–452
Liang X, Zhang D, Lu G, Guo Z, Luo N (2019) A novel multicamera system for high-speed touchless palm recognition. IEEE Trans Syst Man Cybern Syst. https://doi.org/10.1109/TSMC.2019.2898684
Saldner HO, Huntley JM (1997) Temporal phase unwrapping: application to surface profiling of discontinuous objects. Appl Opt 36(13):2770–2775
Samir C, Srivastava A, Daoudi M (2006) Three-dimensional face recognition using shapes of facial curves. IEEE Trans Pattern Anal Mach Intell 28(11): 1858–1863
Tian C, Xu Y, Zuo W (2020) Image denoising using deep CNN with batch renormalization. Neural Netw 121:461–473
Zhang D, Lu G, Li W, Zhang L, Luo N (2009) Palmprint recognition using 3-D information. IEEE Trans Syst Man Cybern Part C (Appl Rev) 39(5):505–519
Zhang D, Kanhangad V, Luo N, Kumar A (2010) Robust palmprint verification using 2D and 3D features. Pattern Recogn 43(1):358–368
Zhang L, Shen Y, Li H, Lu J (2015) 3D palmprint identification using block-wise features and collaborative representation. IEEE Trans Pattern Anal Mach Intell 37(8):1730–1736
Author information
Authors and Affiliations
Corresponding authors
Editor information
Editors and Affiliations
Section Editor information
Rights and permissions
Copyright information
© 2021 Springer Science+Business Media LLC
About this entry
Cite this entry
Zhang, D., Liang, X. (2021). 3D Palmprint. In: Jajodia, S., Samarati, P., Yung, M. (eds) Encyclopedia of Cryptography, Security and Privacy. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-27739-9_1502-1
Download citation
DOI: https://doi.org/10.1007/978-3-642-27739-9_1502-1
Published:
Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-642-27739-9
Online ISBN: 978-3-642-27739-9
eBook Packages: Springer Reference Computer SciencesReference Module Computer Science and Engineering