Abstract
In recent years, manufacturing smaller and lighter devices has been the trend for both mobile phones and all other portable products. One of the most important factors leading to weight reduction has been the adoption of both BGAs (ball grid arrays) and CSPs (chip scale packages).
This is a preview of subscription content, log in via an institution to check access.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
Preview
Unable to display preview. Download preview PDF.
References
Darveaux R, Syed A Reliability of area array solder joints inbending. White Paper disponibile consultando il sito internet http://www.amkor.com
Electronic Industries Association of Japan (1992) Standard of Electronic Industries Association of Japan: Mechanical stress test methods for semiconductor surface mounting devices
Shetty S, Lehtinen V, Dasgupta A, Halkola V, Reinikainen T (1999) Effect of bending on chip scale package interconnects. ASME International Mechanical Engineering Congress, Nashville
Leicht L, Skipor A (1998) Mechanical cycling fatigue of PBGA package interconnects. Proceedings of the International Symposium on Microelectronics
Juso H, Yamaji Y, Kimura T, Fujita K, Kada M (2000) Board levelreliability of CSP. Proc IEEE ECTC
Perera UD (1999) Evaluation of reliability of μBGA solder joints through twisting and bending. Microelectron Reliab No. 39
Rooney DT, Castello NT, Cibulsky M, Abbott D, Xie D (2004) Materials characterization of the effect of mechanical bending on area array package interconnects. Microelectron Reliab No. 4
Tee TY, Ng HS, Luan J, Yap D, Loh K, Pek E, Lim CT, Zhong Z (2004) Integrated modeling and testing of fine-pitch CSP under board level drop test, bend test and thermal cycling test. ICEP Conference, Japan
JEDEC (2003) Board level drop test method of components for handheld electronic products. Standard JESD22-B111
JEDEC (2001) Mechanical shock. Standard JESD22-B104-B
Chiu A, Pek E, Lim CT, Luan J, Tee TY Zhong Z (2004) Modal analysis and spectrum analysis of PCB under drop impact. SEMICON Singapore
Pek E, Lim CT, Tee TY, Luan J, Zhong Z (2004) Novel numerical and experimental analysis of dynamic responses under board level drop test. EuroSIME Conference, Belgium
Pek E, Lim CT, Tee TY, Luan J, Zhong Z (2004) Advanced experimental and simulation techniques for analysis of dynamic responses during drop impact. 54th ECTC Conference, USA
Abe M, Kumai T, Higashiguchi Y, Tsubone K, Mishiro K, Ishikawa S (2002) Effect of the drop impact on BGA/CSP package reliability. Microelectron Reliab No. 42
Ng HS, Tee TY, Zhong Z (2003) Design for enhanced solder joint reliability of integrated passives device under board level drop test and thermal cycling test. 5th EPTC Conference, Singapore
Luan J, Yap D, Loh K, Pek E, Lim CT, Tee TY, Ng HS, Zhong Z (2004) Integrated modeling and testing of fine-pitch CSP under board level drop test, bend test, and thermal cycling test. ICEP Conference, Japan
Lim CT, Pek E, Tee TY, Ng HS, Zhong Z (2003) Board level drop test and simulation of TFBGA packages for telecommunication applications. 53rd ECTC Conference, USA
Huang CY, Liao CC, Zheng PJ, Hung SC, Wu JD, Ho SH (2002) Board level reliability of a stacked CSP subjected to cyclic bending. Microelectron Reliab No. 42
Tee TY, Ng HS (2000) Board level solder joint reliability modeling on TfBGA package. International Conference on Electronic Reliability
Author information
Authors and Affiliations
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 2008 Springer-Verlag Berlin Heidelberg
About this chapter
Cite this chapter
Radente, S., Borsini, S. (2008). Board Level Reliability. In: Micheloni, R., Campardo, G., Olivo, P. (eds) Memories in Wireless Systems. Signals and Communication Technology. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-540-79078-5_8
Download citation
DOI: https://doi.org/10.1007/978-3-540-79078-5_8
Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-540-79077-8
Online ISBN: 978-3-540-79078-5
eBook Packages: EngineeringEngineering (R0)