Abstract
Users require inexpensive, reliable sensors and actuators compatible with modern signal processing circuitry. This demand can be satisfied by microsensors and microactuators (microelectromechanical systems, MEMS), notably based on silicon with on-chip circuitry fabricated by using integrated circuit (IC) technology. A large number of such MEMS are based on thermal and thermoelectric principles. They use thermoresistive and thermoelectric thin films for sensor or actuator operation and the concepts of micromachining for device optimization. Indeed, a variety of thermal-based microsensors and microactuators fabricated by standard semiconductor technologies have been demonstrated. [1–4]
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Vöelklein, F. (2006). Thermal-Based Microsensors. In: Korvink, J.G., Paul, O. (eds) MEMS: A Practical Guide to Design, Analysis, and Applications. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-540-33655-6_5
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DOI: https://doi.org/10.1007/978-3-540-33655-6_5
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