Abstract
In this chapter, we present Tunnel FETs (TFETs) obtained with a FDSOI CMOS process flow featuring High-K Metal Gate, ultrathin body compressively strained Si1-xGex (x from 0 to 30 %) based channels, and Si0.7Ge0.3 Raised SD. In-depth characterizations have been conducted to analyze the device structures (TEM, EELS for atom/layer identification, HAADF STEM GPA for strain) and device electrical performance (C(V), I D (V G ) vs. V DS and temperature, I ON , S w , tunnel extractions…). We investigate the tunneling improvements due to the different technological injection boosters: ultrathin body and gate dielectrics, strain, low band gap source, and low temperature SD anneal. The impact on I D (V G ) curves and thus on ON (and OFF) state current, subthreshold slope is presented and discussed. For the first time, TFETs with large ON current (up to 428 µA/µm) are demonstrated (with >×1,000 I ON gain vs. SOI TFETs, and >×35 I ON gain vs. best published pTFETs). Future paths towards further enhanced TFET devices are also detailed.
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Acknowledgments
This work was partly supported by the european “STEEPER” project (no. 257267) and the french MINOS network of excellence. The authors thank also B. Prévitali, P. Perreau, F. Allain, F. Andrieu, O. Weber, O. Faynot and T. Poiroux (from CEA Leti) for contributions in device processing, electrical characterization and mana-gerial support
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Le Royer, C. et al. (2014). High-Performance Tunnel FETs on Advanced FDSOI Platform. In: Nazarov, A., Balestra, F., Kilchytska, V., Flandre, D. (eds) Functional Nanomaterials and Devices for Electronics, Sensors and Energy Harvesting. Engineering Materials. Springer, Cham. https://doi.org/10.1007/978-3-319-08804-4_4
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DOI: https://doi.org/10.1007/978-3-319-08804-4_4
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