Abstract
During the funding project EmPower a new embedding concept was developed for integration of power components. The embedding technology shows promising potential for automotive applications regarding high miniaturization potential as well as good electrical and thermal performance. Additionally the concept provides good reflow stability and thermal shock behavior. This could be realized with the demonstrators of the EmPower project and single chip test vehicle for deeper investigation of the potentials of this embedding technology according AEC-Q101 requirements. High robustness on power cycling was an outstanding exploration result.
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Stahr, J., Morianz, M. (2019). Powering Up Electronics—Latest Developments and Concepts for Packaging of Electronics in Automotive Systems. In: Langheim, J. (eds) Electronic Components and Systems for Automotive Applications . Lecture Notes in Mobility. Springer, Cham. https://doi.org/10.1007/978-3-030-14156-1_10
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DOI: https://doi.org/10.1007/978-3-030-14156-1_10
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