Abstract
A technique for interconnecting high-frequency circuits in which an interconnection path is cut into a grooved aluminum plate and a printed circuit run is centered in this groove is given. The remaining exposed portions of the groove are filled with an encapsulation compound to the height of the aluminum plate. The final step is to plate the encapsulation compound, and in this manner all interconnection runs are completely surrounded by metal, thereby effecting complete shielding of all runs.
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References
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© 1965 Springer Science+Business Media New York
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Thibodeau, W.L. (1965). High-Frequency Interconnections. In: Rosine, L.L. (eds) Advances in Electronic Circuit Packaging. Springer, Boston, MA. https://doi.org/10.1007/978-1-4899-7307-8_17
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DOI: https://doi.org/10.1007/978-1-4899-7307-8_17
Publisher Name: Springer, Boston, MA
Print ISBN: 978-1-4899-7295-8
Online ISBN: 978-1-4899-7307-8
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