Abstract
The IC industry has improved process yield and device reliability considerably over the last few years. Much of the improvement is the result of continuing reduction in the defect density on IC wafers, a result made possible in part through the use of suitable defect detection and wafer inspection systems. These systems, however, are useful only for surface or visible defects.
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Smith, W.L., Welles, C.G., Rosencwaig, A. (1990). Thermal Wave Imaging of Nonvisible Defects in IC Devices. In: Thompson, D.O., Chimenti, D.E. (eds) Review of Progress in Quantitative Nondestructive Evaluation. Review of Progress in Quantitative Nondestructive Evaluation. Springer, Boston, MA. https://doi.org/10.1007/978-1-4684-5772-8_138
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DOI: https://doi.org/10.1007/978-1-4684-5772-8_138
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