Abstract
Recent advances in ductilizing the intermetallic compound Ni3A1 may lead to practical applications. These applications, which are based on the outstanding strength and oxidation resistance of the compound, also require physical property data. In this paper, the room-temperature electrical and thermal conductivities of annealed high purity specimens containing 74 to 76 at. % Ni are presented and compared to theoretical predictions. Residual (4.2 K) electrical resistivity data are also employed in the analysis and these results show a pronounced minimum at the stoichiometric composition. The data show that the thermal conductivity of this compound is quite sensitive to stoichiometry and, at room temperature, has a maximum value at about 74.8 at.% Ni. Calculated and experimentally derived phonon thermal conductivity values agree well, and indicate that this carrier is responsible for about 25% of the room temperature thermal conductivity. The electronic Lorenz function is essentially equal to the Sommerfeld value.
Research sponsored by the Division of Materials Science, U.S. Department of Energy, under contract DE-AC05-840R21400 with Martin Marietta Energy Systems, Inc.
This is a preview of subscription content, log in via an institution to check access.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
Preview
Unable to display preview. Download preview PDF.
Similar content being viewed by others
References
Bieber, G. C. and Randebaugh, R. J., “Some Age Hardening Characteristics of Nickel-Chromium Alloys (Nickel-Rich) Containing Aluminum and Titanium,” p. 417 in Precipitation from Solid Solution, American Society for Metals, 1959.
Copley, S. M., and Kerr, B. H., Trans. AIME 239, 977 (1967).
Aoki, K., and Izumi, O., Nippon Kinzoku Gakkaishi 43, 1190 (1979).
Liu, G. T., and Koch, C. C., “Development of Ductile Polycrystalline Ni3Al for High Temperature Applications,” p. 42 in Technical Aspects of Critical Materials Use by the Steel Industry, Vol. IIB, NBSIR 83-2679-2, Center for Materials Science, National Bureau of Standards, 1983.
Fluitman, J.H.J., Boom, R., de Chatel, P. F., Schinkel, C. J., Tilanns, J.L.L., and DeVries, B. R., J. Phys F: Metal. Phys. 109 (1973).
Williams, R. K., Graves, R. S., and Moore, J. P., ORNL-5313 (1978).
Dodd, C. V., Materials Evaluation XXVI, 33 (1968).
Jury, S. H., Arnurius, D., Godfrey, T. G., McElroy, D. L., and Moore, J. P., J. Franklin Inst. 298, 151 (1974).
Williams, R. K., Yarbrough, D. W., Masey, J. W., Holder, T. K., and Graves, R. S., J. Appl. Phys. 52, 5167 (1981).
Blatt, F. J., Physics of Electronic Conduction in Solids, McGraw-Hill, New York, NY (1968).
de Dood, W., and de Chatel, P. F., J. Phys. F: Metal. Phys. 3 1039 (1973).
Kortekaas, T.F.M., and Franse, J., Phys. State. Sal. 40, 479 (1977).
Williams, R. K., Graves, R. S., Hebble, T. L., McElroy, D. L., and Moore, J. P., Phys. Rev. B 26, 2932 (1982).
Williams, R. K., Butler, W. H., Graves, R. S., and Moore, J. P., submitted to Physical Review B.
Callaway, J., Phys. Rev. 113, 1046 (1959).
Roufosse, M., and Klemens, P. G., Phys. Rev. B 7 5379 (1973).
Yarbrough, D. W., and Williams, R. K., 0RNL-5434 (1978).
Gschneidner, K. A., “Solid State Physics 16,” p. 275, F. Seitz and D. Turnbull, eds., Academic Press, Inc., New York, NY (1969).
Ho, C. Y., Ackerman, M. W., Wu, K. Y., Oh, S. G., and Havill, N. T., J. Phys. Chem. Ref. Data 7, 959 (1978).
Williams, R. K., and Yarbrough, D. W., unpublished research.
Author information
Authors and Affiliations
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 1985 Purdue Research Foundation
About this chapter
Cite this chapter
Williams, R.K., Weaver, F.J., Graves, R.S. (1985). Transport Properties of Polycrystalline Ni3Al. In: Ashworth, T., Smith, D.R. (eds) Thermal Conductivity 18. Springer, Boston, MA. https://doi.org/10.1007/978-1-4684-4916-7_19
Download citation
DOI: https://doi.org/10.1007/978-1-4684-4916-7_19
Publisher Name: Springer, Boston, MA
Print ISBN: 978-1-4684-4918-1
Online ISBN: 978-1-4684-4916-7
eBook Packages: Springer Book Archive