Manufacture of an Integrated Circuit Package

Abstract

Many techniques have been used to produce integrated circuit packages. All of these assembly methods, such as beam lead, spider, flip chip and others require a large number of separate and distinct processing steps, frequently causing high costs and poor reliability (1). In the chip and wire process, for example, a large number of very fine aluminum lead wires are bonded by ultrasonic cold welding to pads on the semiconductor chip, and in turn to tips of leads on the metal lead frame. Failure of the devise will occur if any of these bonds are defective.