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Adhesive and Its Application

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Surface Mount Technology

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Abstract

An adhesive in sort ace mounting is used to hold passive components on the bottom side of the hoard during wave soldering. This is necessary to avoid the displacement of these components under the action of the wave. When soldering is complete, the adhesive no longer has a useful function.

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References

  1. Specifications on Adhesives, available from IPC, Northbrook, IL

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  2. IPC-SM-817. General Requirements for Dielectric Surface Mount Adhesives.

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  3. IPCIPC-3406. Guidelines for Conductive Adhesives.

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  4. IPCIPCIPC-3407. General Requirements for Isotropically Conductive Adhesives.

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  5. IPC-3408. General Requirements for Anisotropically Conductive Adhesives.

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  6. Pound, Ronald. “Conductive epoxy is tested for SMT solder replacement.” Electronic Packaging and Production, February 1985, pp. 86–90.

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  7. Zarrow, Phil, and Kopp, Debra. “Conductive Adhesives.” Circuit Assembly, April 1996, pp. 22–25.

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  8. Meeks, S. “Application of surface mount adhesive to hot air leveled solder (HASL) circuit board evaluation of the bottom side adhesive dispense.” Paper IPC-TR-664, presented at the IPC fall meeting, Chicago, 1987.

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  9. Kropp, Philip, and Eales, S. Kyle. “Trouble shooting guide for surface mount adhesive.” Surface Mount Technology, August 1988, pp. 50–51.

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  10. Aspandiar, R., Intel Corporation, internal report, February, 1987.

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Author information

Authors and Affiliations

  1. Ray Prasad Consultancy Group, Portland, Oregon, USA

    Ray P. Prasad

Authors
  1. Ray P. Prasad
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© 1997 Springer Science+Business Media Dordrecht

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Prasad, R.P. (1997). Adhesive and Its Application. In: Surface Mount Technology. Springer, Boston, MA. https://doi.org/10.1007/978-1-4615-4084-7_8

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  • DOI: https://doi.org/10.1007/978-1-4615-4084-7_8

  • Publisher Name: Springer, Boston, MA

  • Print ISBN: 978-0-412-12921-6

  • Online ISBN: 978-1-4615-4084-7

  • eBook Packages: Springer Book Archive

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