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Through Hole Plating

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Copper Electrodeposition for Nanofabrication of Electronics Devices

Part of the book series: Nanostructure Science and Technology ((NST))

Abstract

Plated through hole (PTH) is an age-old process technology, especially in the fabrication of printed circuit boards (PCBs). However, PTH is still employed currently for advanced PCB fabrication. The main differences between the conventional PTHs and the current PTHs are acceptable criteria of process and reliability.

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Author information

Authors and Affiliations

  1. Department of Chemical Engineering, National Chung Hsing University, 250, Kuo-Kuang Road, Taichung, 40227, Taiwan

    Wei-Ping Dow

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  1. Wei-Ping Dow
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Correspondence to Wei-Ping Dow .

Editor information

Editors and Affiliations

  1. Dept. of Chemical Engineering, Osaka Prefecture University, Osaka, Japan

    Kazuo Kondo

  2. Intel Corporation, Hillsboro, Oregon, USA

    Rohan N. Akolkar

  3. Dept. of Chemical Engineering, University of New Hampshire, Durham, New Hampshire, USA

    Dale P. Barkey

  4. Industrial Technology Support Institute, Osaka Prefecture, Japan

    Masayuki Yokoi

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Dow, WP. (2014). Through Hole Plating. In: Kondo, K., Akolkar, R., Barkey, D., Yokoi, M. (eds) Copper Electrodeposition for Nanofabrication of Electronics Devices. Nanostructure Science and Technology. Springer, New York, NY. https://doi.org/10.1007/978-1-4614-9176-7_11

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