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Electron Microscopy

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Characterization of Solid Surfaces

Abstract

There is hardly a field in materials science where the physical nature of the surface is not an important feature. for example, in fatigue fracture, cracks nucleate at the surfaces of materials and the rate at which they nucleate is greatly influenced by the detailed topography of the surfaces. in the field of thin-film devices, the manufacturing tendency has been to reduce the size of electronic components. Surface-to- volume ratios are now exceedingly high. Young points out that we are not far from the point where we can anticipate devices employing single layers of atoms.(1) However, the device industry, which presently employs films in the 10- to 100-Å range, suffers very high failure rates due to surface imperfections, stacking-fault intersections, voids in the films, thermally induced pits, and multiple steps. as a result of these deficiencies, large resources have been employed to control the imperfections by close control of processing variables. in other areas, elaborate polishing, cleaning, and smoothing techniques have been developed in an effort to eliminate the variability associated with surfaces. However, none of these efforts can improve upon a detailed knowledge of the actual surface topography.

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Authors and Affiliations

  1. School of Metallurgy and Materials Science, University of Pennsylvania, Philadelphia, Pennsylvania, USA

    Campbell Laird

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  1. Campbell Laird
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Editors and Affiliations

  1. Materials Characterization Laboratory, Texas Instruments Incorporated, Dallas, Texas, USA

    Philip F. Kane  & Graydon B. Larrabee  & 

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© 1974 Plenum Press, New York

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Laird, C. (1974). Electron Microscopy. In: Kane, P.F., Larrabee, G.B. (eds) Characterization of Solid Surfaces. Springer, Boston, MA. https://doi.org/10.1007/978-1-4613-4490-2_5

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  • DOI: https://doi.org/10.1007/978-1-4613-4490-2_5

  • Publisher Name: Springer, Boston, MA

  • Print ISBN: 978-1-4613-4492-6

  • Online ISBN: 978-1-4613-4490-2

  • eBook Packages: Springer Book Archive

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