Abstract
Semiconductor manufacturing, one of the fields of manufacturing in which the USA has played a dominant role for decades, is seen as a major consumer of resources and a source of environmental impact. The objective of this chapter is to introduce the basics of semiconductor manufacturing and, then, look at a detailed analysis of the energy and global warming impact of manufacturing one typical semiconductor product, the complementary metal oxide semiconductor (CMOS) chip. Process steps are reviewed, materials, consumables, and waste streams described, and then an example of applying life-cycle analysis to CMOS fabrication and use (including materials processing through transportation and use phases) is presented. The level of data detail required is illustrated along with trends in manufacturing and environmental impact over several technology nodes.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
References
Boyd S (2009) Life-cycle assessment of semiconductors. Ph.D. thesis, University of California, Berkeley, Mechanical Engineering
Boyd S (2011) Life-cycle assessment of semiconductors. Springer, New York
Zhang TW, Bates SW, Dornfeld DA (2007) Operational energy use of plasmonic imaging lithography. Proceedings of the IEEE international symposium on electronics and environment (ISEE), May 2007
ITRS (2008) Sematech. The international technology roadmap for semiconductors, 2007 edn. Technical report
Filterair (2011) http://www.filterair.info/articles/article.cfm/ArticleID/6ECA4042-A748-400F-8A2FC1798F6B337C/Page/1. Accessed 4 May 2011
N. Krishnan, S. Thurwachter, T. Francis, and P. Sheng (2000) The environmental value systems (env-s) analysis: application to CMP effluent treatment options. Proceedings of the Electrochemical Society (ECS) Conference on improving environmental performance of wafer manufacturing processes. ECS
Krishnan N (2003) Design for environment (DfE) in semiconductor manufacturing. Ph.D. thesis, Mechanical Engineering, University of California at Berkeley
Sherer J (2005) J. Michael Sherer, Semiconductor industry: wafer fab exhaust management, CRC Press, Boca Raton, Florida
WSC (2010) Joint Statement of the 14th Meeting of the World Semiconductor Council (WSC), WSC, May 27, 2010, Seoul, South Korea
Prather MJ, Hsu J (2008) NF3, the greenhouse gas missing from Kyoto. Geophys Res Lett 35:L12810
Hoag H (2008) The missing greenhouse gas. Nat Rep Clim Change. doi:10.1038
Energy Star (2011) http://www.energystar.gov/. Accessed 2 May 2011
Alliance to Save Energy (2007) PC energy report 2007, United States. Unpublished report. available online: http://www.climatesaverscomputing.org/docs/Energy_Report_US.pdf
Sustainability Consortium (2011) http://www.sustainabilityconsortium.org/electronics/. Accessed 2 May 2011
Toffel MW, Horvath A (2004) Environmental implications of wireless technologies: news delivery and business meetings. Environ Sci Technol 38(11):2961–2970
Kim J, Xu M, Kahhat R, Allenby B, Williams E (2009) Designing and assessing a sustainable networked delivery (SND) system: hybrid business-to-consumer book delivery case study. Environ Sci Technol 43(1):181–187
Rosenblum J, Horvath A, Hendrickson C (2000) Environmental implications of service industries. Environ Sci Technol 34(22):4669–4676
EPA (2007) EPA report to congress on server and data center energy efficiency. Technical report, U.S. Environmental Protection Agency
Carnegie-Mellon (2009) Carnegie Mellon University Green Design Institute. Economic Input–output life cycle assessment (EIO-LCA), US 1997 industry benchmark model, economic input–output life cycle assessment (EIO-LCA), US 1997 Industry Benchmark model. http://www.eiolca.net. Accessed 15 May 2009
Watanabe A, Kobayashi T, Egi T, Yoshida T (1999) Continuous and independent monitor wafer reduction in DRAM fab. In IEEE International symposium on semiconductor manufacturing conference proceedings, IEEE, pp 303–306
Williams ED, Ayres RU, Heller M (2002) The 1.7 kilogram microchip: energy and material use in the production of semiconductor devices. Environ Sci Technol 36(24):5504–5510
Plepys A (2004) The environmental impacts of electronics: going beyond the walls of semiconductor fabs. Proceedings of the IEEE international symposium on electronics and the environment, IEEE, pp 159–165
Krishnan N, Williams E, Boyd S (2008a) Case studies in energy use to realize ultra-high purities in semiconductor manufacturing. Proceedings of the IEEE international symposium on electronics and the environment, IEEE
Kim S, Overcash M (2003) Energy in chemical manufacturing processes: gate-to-gate information for life cycle assessment. J Chem Technol Biotechnol 78(8):995–1005
Phylipsen GJM, Alsema EA (1995) Environmental life-cycle assessment of multicrystalline silicon solar cell modules (report no. 95057). Technical report, Department of Science, Technology and Society, Utrecht University, The Netherlands
Stokes J, Horvath A (2006) Life cycle energy assessment of alternative water supply systems. Int J Life Cycle Assess 11(5):335–343
Williams SM (2007) The Santa Clara Valley Water District Fiscal Year 2007–08 five-year capital improvement program. Technical report, Santa Clara Valley Water District
PG&E (2008) Power content label. Available online: www.pge.com. Last accessed December 2008
Pacca S, Horvath A (2002) Greenhouse gas emissions from building and operating electric power plants in the Upper Colorado River Basin. Environ Sci Technol 36(14):3194–3200
Fthenakis V, Kim H (2007) Greenhouse-gas emissions from solar electric and nuclear power: a life-cycle study. Energy Policy 35:2549–2557
EPA (2008) The emissions & generation resource integrated database for 2007 (eGrid2007) Technical Support Document. U.S. Environmental Protection Agency, September 2008
Di X, Nie Z, Yuan B, Zuo T (2007) Life cycle inventory for electricity generation in China. Int J Life Cycle Assess 12(4):217–224
Williams E (2004) Energy intensity of computer manufacturing: hybrid assessment combining process and economic input–output methods. Environ Sci Technol 38(22):6166–6174
Census Bureau (2005) Statistics for industry groups and industries, annual survey of manufacturers. U.S. Census Bureau, Washington, DC
Sematech (1999) The international technology roadmap for semiconductors: 2005, 2003, 2001 and 1999 editions. Technical report, 1999–2005
Hu SC, Chuah YK (2003) Power consumption of semiconductor fabs in Taiwan. Energy 28(8):895–907
O’Halloran M (2002) Fab utility cost values for cost of ownership (CoO) calculations, Technology Transfer #02034260A-TR, available on-line: www.sematech.org/docubase/abstracts/4260atr.htm. Technical Report 02034260A-TR, International Sematech
Lawrence Berkeley National Laboratory (2001) High-tech Buildings - Market Transformation Projects: A Final Report to CIEE/PG&E, Technical Report LBNL-49112, Berkeley, California. Available online: http://ateam.lbl.gov/cleanroom/index.htm
Krishnan N, Boyd S, Somani A, Raoux S, Clark D, Dornfeld D (2008) A hybrid life cycle inventory of nano-scale semiconductor manufacturing. Environ Sci Technol 42(8):3069–3075
IPCC (2007) PCC Climate change 2007: the physical science basis, contribution of working group I to the fourth assessment report of the intergovernmental panel on climate change. Cambridge University Press, Cambridge
Facanha C, Horvath A (2007) Evaluation of life cycle air emission factors of freight transportation. Environ Sci Technol 41(20):7138–7144
Cremer C, Eichhammer W, Friedewald M, Georgie P, Rieth-Hoerst S, Schlomann B, Zoche P, Aebischer B, Huser A (2003) Energy consumption of information and communication technology in Germany up to 2010. Technical report
Roth KW, Goldstein F, Kleinman J (2002) Energy consumption by office and telecommunications equipment in commercial buildings. volume i: energy consumption baseline, adl 72895–00. Technical report
ITRS (2007) Sematech. The international technology roadmap for semiconductors, 2007 edition. Technical report
Yung-Cheng JC, Cheng F (2005) Application development of virtual metrology in semiconductor industry. Proceedings of the IEEE industrial electronics society conference. IEEE
Hsu J, Lo H, Pan C, Chen Y, Hsieh T (2004) Test wafer control system in 300 mm fab. Semiconductor manufacturing technology workshop proceedings, IEEE, pp 33–36
Foster B, Meyersdor D, Padillo J, Brenner R (1998) Simulation of test wafer consumption in a semiconductor facility. IEEE/SEMI advanced semiconductor manufacturing conference and workshop, IEEE, pp 298–302
IPCC (2001) Good practice guidance and uncertainty management in national greenhouse gas inventories. IPCC-TSU NGGIP, Japan
Author information
Authors and Affiliations
Corresponding author
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 2013 Springer Science+Business Media New York
About this chapter
Cite this chapter
Boyd, S., Dornfeld, D. (2013). Semiconductor Manufacturing. In: Dornfeld, D. (eds) Green Manufacturing. Springer, Boston, MA. https://doi.org/10.1007/978-1-4419-6016-0_7
Download citation
DOI: https://doi.org/10.1007/978-1-4419-6016-0_7
Published:
Publisher Name: Springer, Boston, MA
Print ISBN: 978-1-4419-6015-3
Online ISBN: 978-1-4419-6016-0
eBook Packages: EngineeringEngineering (R0)