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CMOS IR-UWB Transceiver System Design for Contact-Less Chip Testing Applications

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Circuits and Systems for Future Generations of Wireless Communications

Part of the book series: Series on Integrated Circuits and Systems ((ICIR))

Today's semiconductor products are more complex and highly integrated due to the increasing demands for system-on-chip solution, which results in a significant increase in time, cost and complexity of testing. Testing of semiconductors has become a significant and growing problem in the very-large-scale-integration (VLSI) circuit manufacturing industry [1, 2]. Semiconductor testing issues such as smaller pad size, increased pad density, increased signal input/output (I/O) frequencies, longer test times, and probe card contact and alignment are restricting the progress towards smaller, faster, and more economical integrated circuits [3].

Conventional wafer probing techniques utilize probe tips to contact the deviceunder- test (DUT) physically and have the limitations of the number of pads, pitch sizes, operating frequency, parallel testing capability and risk of damage to the DUT. Moreover, the calibration of probe tips and silicon substrate especially for highspeed RF circuits have made testing more complicated and may affect the accuracy of testing.

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Author information

Authors and Affiliations

  1. Berkeley Wireless Research Center, Department of Electrical Engineering and Computer Sciences, University of California at Berkeley, Berkeley, CA, 94720, USA

    Yanjie Wang & Ali M. Niknejad

  2. Department of Electrical and Computer Engineering, University of Alberta, Edmonton, AB, T6G 2V4, Canada

    Ali M. Niknejad & Vincent Gaudet

  3. CMOS Emerging Technologies Inc., 2865 Stanley Pl. Coquitlam, BC, V3B 7L7, Canada

    Kris Iniewski

Authors
  1. Yanjie Wang
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  2. Ali M. Niknejad
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  3. Vincent Gaudet
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  4. Kris Iniewski
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Editor information

Editors and Affiliations

  1. Qualcomm Inc., 5775 Morehouse Dr., San Diego, CA, 92121, USA

    Aleksandar Tasić

  2. Delft University of Technology, Electronics Research Lab., Mekelweg 4, CD Delft, ET Bldg., 2628, Netherlands

    Wouter A. Serdijn

  3. Dept. Electrical & Computer Engineering, University of California San Diego, 9500 Gilman Drive, La Jolla CA, MS 0407, 92093—0407, USA

    Lawrence E. Larson

  4. Dept. Engineering (ENDIF), University of Ferrara, Via Saragat, 1, Ferrara, 44100

    Gianluca Setti

  5. Ad. Research Center on Electronic Systems (ARCES), University of Bologna, Via toffano 2/2, Bologna, 40136, Italy

    Gianluca Setti

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Wang, Y., Niknejad, A.M., Gaudet, V., Iniewski, K. (2009). CMOS IR-UWB Transceiver System Design for Contact-Less Chip Testing Applications. In: Tasić, A., Serdijn, W.A., Larson, L.E., Setti, G. (eds) Circuits and Systems for Future Generations of Wireless Communications. Series on Integrated Circuits and Systems. Springer, Dordrecht. https://doi.org/10.1007/978-1-4020-9917-5_5

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  • DOI: https://doi.org/10.1007/978-1-4020-9917-5_5

  • Publisher Name: Springer, Dordrecht

  • Print ISBN: 978-1-4020-9918-2

  • Online ISBN: 978-1-4020-9917-5

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