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Part of the book series: Solid Mechanics and its Applications ((SMIA,volume 144))

Abstract

In order to model the effects of grain boundaries in nanocrystalline materials we have coupled a crystal-plasticity model for the grain interiors with a new elastic-plastic grainboundary interface model which accounts for both reversible elastic, as well irreversible inelastic sliding-separation deformations at the grain boundaries prior to failure. We have used this new computational capability to study the deformation and fracture response of nanocrystalline nickel. The results from the simulations capture the macroscopic experimentally-observed tensile stress-strain curves, and the dominant microstructural inelastic deformation and fracture mechanisms in this material. The macroscopically-observed nonlinearity in the stress-strain response is mainly due to the inelastic response of the grain boundaries. Plastic deformation in the interior of the grains prior to the formation of grain-boundary cracks was rarely observed. The stress concentrations at the tips of the distributed grain-boundary cracks, and at grain-boundary triple junctions, cause a limited amount of plastic deformation in the high-strength grain interiors. The competition of grain-boundary deformation with that in the grain interiors determines the observed macroscopic stress-strain response, and the overall ductility. In nanocrystalline nickel, the high yield strength of the grain interiors and relatively weaker grain-boundary interfaces account for the low ductility of this material in tension.

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Anand, L., Wei, Y. (2007). Mesoscopic Modeling of the Deformation and Fracture of Nanocrystalline Metals. In: Bai, Y.L., Zheng, Q.S., Wei, Y.G. (eds) IUTAM Symposium on Mechanical Behavior and Micro-Mechanics of Nanostructured Materials. Solid Mechanics and its Applications, vol 144. Springer, Dordrecht. https://doi.org/10.1007/978-1-4020-5624-6_1

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  • DOI: https://doi.org/10.1007/978-1-4020-5624-6_1

  • Publisher Name: Springer, Dordrecht

  • Print ISBN: 978-1-4020-5623-9

  • Online ISBN: 978-1-4020-5624-6

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