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Future Trend of Conductive Adhesive Technology

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Electrical Conductive Adhesives with Nanotechnologies
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Abstract

As can be seen from previous chapters, tremendous progress has been made to improve the conductive adhesive technology for ICAs, ACA, and NCA.

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References

  1. J. Wu, K. Moon, and C. P. Wong, “Self-Alignment Feasibility Study and Contact Resistance Improvement of Electrically Conductive Adhesives (ECAs),”Proceedings of 51st Electronic Components and Technology Conference, Orlando, FL, pp. 571–575, 2001.

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  5. Y. Li, M. J. Yim, K. Moon, R. W. Zhang, and C. P. Wong, “Development of Novel, Flexible, Electrically Conductive Adhesives for Next-Generation Microelectronics Interconnect Applications,”Proceedings of 58th IEEE Electronic Components and Technology Conference, pp. 1272–1276, 2008.

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  7. M. J. Yim and K. W. Paik, “Effect of Nonconducting Filler Additions on ACA Properties and the Reliability of ACA Flip-Chip on Organic Substrates,”IEEE Transactions on Components and Packaging Technologies, 24, 24–32, 2001.

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Correspondence to Yi Li .

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Li, Y., Lu, D., Wong, C.P. (2010). Future Trend of Conductive Adhesive Technology. In: Electrical Conductive Adhesives with Nanotechnologies. Springer, Boston, MA. https://doi.org/10.1007/978-0-387-88783-8_9

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  • DOI: https://doi.org/10.1007/978-0-387-88783-8_9

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  • Publisher Name: Springer, Boston, MA

  • Print ISBN: 978-0-387-88782-1

  • Online ISBN: 978-0-387-88783-8

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