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Introduction

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Electrical Conductive Adhesives with Nanotechnologies

Abstract

Integrated circuits (ICs) form the bases of all modern electronic products. However, an IC alone does not form a complete system and it must be integrated with other components into a system-level board. “Electronic Packaging” is defined as the bridge that interconnects the integrated circuits (ICs) and other components into a system-level board to form electronic products [1]. The packaging has four main functions: (1) signal distribution, mainly involving topological and electromagnetic considerations; (2) power distribution, involving electromagnetic, structural, and material aspects; (3) heat dissipation (thermal management), involving structural and material considerations; (4) and protection (mechanical, chemical, electromagnetic) of components and interconnections.

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Author information

Authors and Affiliations

  1. School of Materials Science and Engineering, Georgia Institute of Technology, 771 Ferst Drive, 30332-0245, Atlanta, GA, USA

    Yi Li & C. P. Wong (Prof)

  2. Henkel Loctite (China) Co. Ltd., 5000 W. Chandler Blvd, 264006, Chandler, People’s Republic China

    Daniel Lu

Authors
  1. Yi Li
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  2. Daniel Lu
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  3. C. P. Wong
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Correspondence to Yi Li .

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Li, Y., Lu, D., Wong, C.P. (2010). Introduction. In: Electrical Conductive Adhesives with Nanotechnologies. Springer, Boston, MA. https://doi.org/10.1007/978-0-387-88783-8_1

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  • DOI: https://doi.org/10.1007/978-0-387-88783-8_1

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  • Publisher Name: Springer, Boston, MA

  • Print ISBN: 978-0-387-88782-1

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