Abstract
As some actual or future prototypes for electronic motion control are designed with higher chip density and constraints for integration challenges, new electromagnetic interactions and compatibility cases have to be considered and modeled to prevent really bad electromagnetic compliance and less-of-motion risks. In consequence, the reliability and the functionalities of the embedded system itself can be affected. First this chapter deals with emission and immunity studies combined with temperature influence on electronic devices used to control power electronic motion modules. Specific Thermal-EM test setup and boards especially developed for these investigations are described. Then experimental results and first approaches of global modeling work for this issue on modern PCB technology are discussed.
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Dienot, JM. (2010). Investigations of Electromagnetic Behavior and Interaction of Motion Control Electronic Devices. In: Sabath, F., Giri, D., Rachidi, F., Kaelin, A. (eds) Ultra-Wideband, Short Pulse Electromagnetics 9. Springer, New York, NY. https://doi.org/10.1007/978-0-387-77845-7_42
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DOI: https://doi.org/10.1007/978-0-387-77845-7_42
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