Abstract
Polishing methods for TEM specimen preparation compete with FIB methods with regard to relative simplicity, success rate, and the ability to produce site-specific specimens in a timely manner—until the site-specific target resolution for the most advanced semiconductor specimens dropped below 0.5 µm. Beyond this point only FIB methods can yield specimens with the required degree of specificity. A procedure for preparing SEM and TEM specimens utilizing a combination of polishing and FIB techniques is presented that capitalizes on the best elements of both methods and offers the immense advantage of reducing or eliminating most of the artifacts associated with the FIB technique. Utilizing this hybrid technique offers a path forward when the incorporation of extremely fragile components into near-future semiconductor devices renders the lift-out technique marginally useful.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
Preview
Unable to display preview. Download preview PDF.
References
Anderson RM and Klepeis SJ “Combined Tripod Polishing and FIB Methods for Preparing Semiconductor Plan View Specimens”. Specimen Preparation for Transmission Electron Microscopy of Materials IV, (eds.) R. Anderson, et. al., Materials Research Symposium Series 480, pp 187–192 (1997).
Anderson RM, et al., Microscopy of Semiconducting Materials 1989, Proceedings of the Physics Conference held at Oxford University, 10–13 April 1989, ed. by Cullis, A. G. and Hutchison J. L., Institute of Physics Conference Series Number 100, Bristol and New York (1989).
Anderson RM, et al., Proceedings EUREM 1996, Steer M. Cottrell D (eds.) p 79–80 (1992).
Anderson, RM, “Precision Ion Milling of Layered, Multi-Element TEM Specimens with High Specimen Preparation Spatial Resolution” In Specimen Preparation for Transmission Electron Microscopy of Materials-III, ed. Anderson, et al., Mater. Res. Soc. Proc. 254, Pittsburgh, PA USA pp. 141–148 (1992).
Anderson, RM, et al., Microbeam Analysis—1995, Proceedings of the 29th Annual Meeting of the Microbeam Analysis Society, ed. E. Etz, p. 135 (1995).
Basile D, et al. “FIBXTEM — Focussed Ion Beam Milling for TEM Sample preparation.” Specimen Preparation for Transmission Electron Microscopy of Materials III, (ed.) R. Anderson, Materials Research Symposium Series 254, pp 23–41 (1992).
Benedict JP, et al., “A Method for Precision Specimen Preparation for Both SEM and TEM Analysis.” EMSA Bulletin, 19,2, pp. 74–80 (ovember, 1989)
Benedict JP, et al., “Recent Advances in E.M. Specimen Preparation: Cross-Section samples.” in International Symposium on Electron Microscopy, ed. by Kuo K and Yao J, World Scientific, p. 450–460 (1990a).
Benedict JP, et al., “Procedure for Cross Sectioning Specific Semiconductor Devices for both SEM and TEM Analysis.” In Specimen Preparation for Transmission Electron Microscopy of Materials-II, ed. Anderson, R., Mater. Res. Soc. Proc. 199, Pittsburgh, PA USA pp. 189–204 (1990b).
Benedict, JP, et al. “Recent Developments in the use of the Tripod Polisher for TEM Specimen Preparation.” In Specimen Preparation for Transmission Electron Microscopy of Materials-III, ed. Anderson et al., Mater. Res. Soc. Proc. 254, Pittsburgh, PA USA pp. 121–140 (1992).
Bravman JC, Sinclair R “The Preparation of Cross-section Specimens for Transmission Electron Microscopy.” J Electron Microsc Tech 1:53–61 (1984)
Hauffe W Thesis B, Technical University of Dresden, Dresden (1978)
Hauffe W Proc. 10th National Conference on Electron Microscopy, Phys. Sci. GDR, Leipzig, p. 307–308 (1981)
Hauffe W, DDR Patentschrift DD218954 BL, 29 (September 982)
Hauffe W, “Ion Beam Microtome for Preparation of TEM Samples.” Proc EUREM 1984, 1, pp 105–106 (1984).
Kirk EC et al. “Cross-sectional transmission electron microscopy of precisely selected regions from semiconductor devices.” Inst. Phys. Conf. Series, 100, p 501–506 (1989) and numerous other references by many authors in the following years.
Klepeis SJ, et al., “A Grinding/Polishing Tool for TEM Sample preparation.” In Specimen Preparation for Transmission Electron Microscopy of Materials, ed. Bravman, et al., Mater. Res. Soc. Proc. 115, Pittsburgh, PA USA pp. 179–184 (1987).
Klepeis SJ, et al., “A Technique for Preparing Semiconductor Cross Sections for both TEM and SEM Analysis,” EMSA Proceedings, ed. by Bailey, G.W., San Francisco Press, p. 712–713 (1988).
Klepeis SJ, Proceedings of the 14th International Congress on Electron Microscopy, Vol III, Electron Microscopy 1998, p 541–542 (1998).
Klepeis SJ, et al., “FIB Dimpling: A Method for Preparing Plan-View TEM Specimens,” EMSA Proceedings, ed. by Bailey, G.W., Springer-Verlag Press pp. 506–507 (2000).
Langford RM and Petford-Long AK “Broad ion beam milling of focused ion beam prepared transmission electron microscopy cross sections for high resolution electron microscopy,” J Vac Sci Technol A 19(3), p 982–985 (2001).
Author information
Authors and Affiliations
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 2005 Springer Science+Business Media, Inc.
About this chapter
Cite this chapter
Anderson, R., Klepeis, S.J. (2005). Practical Aspects of FIB Tem Specimen Preparation. In: Giannuzzi, L.A., Stevie, F.A. (eds) Introduction to Focused Ion Beams. Springer, Boston, MA. https://doi.org/10.1007/0-387-23313-X_9
Download citation
DOI: https://doi.org/10.1007/0-387-23313-X_9
Publisher Name: Springer, Boston, MA
Print ISBN: 978-0-387-23116-7
Online ISBN: 978-0-387-23313-0
eBook Packages: Physics and AstronomyPhysics and Astronomy (R0)