Abstract
A new class of organic dielectrics, benzocyclobutenes, 1, are described and their application to the fabrication of thin film multichip modules is detailed. Key properties for3, a siloxy containing BCB derivative include low dielectric constant (2.7), low loss (0.008 at 1 MHz), low water absorption (0.25% after 24 h water boil) and high degree of planarization (>90% from one layer coverage). All other properties meet the requirements necessary for fabrication of thin film MCM structures.
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Burdeaux, D., Townsend, P., Carr, J. et al. Benzocyclobutene (BCB) dielectrics for the fabrication of high density, thin film multichip modules. J. Electron. Mater. 19, 1357–1366 (1990). https://doi.org/10.1007/BF02662825
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DOI: https://doi.org/10.1007/BF02662825