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Solder Joint Reliability and Inspection

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Solder Paste in Electronics Packaging

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Abstract

As illustrated in Chapter 2 about solder paste technology, after reflowing the solder paste and cleaning the residue, another major performance area is solder joint integrity during service. With the functions as electrical, thermal, and mechanical linkage, solder joint integrity in a practical environment is apparently vital to the overall function of the assembly.

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Author information

Authors and Affiliations

  1. SCM Metal Products, Inc., USA

    Jennie S. Hwang Ph. D.

Authors
  1. Jennie S. Hwang Ph. D.
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© 1989 Van Nostrand Reinhold

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Hwang, J.S. (1989). Solder Joint Reliability and Inspection. In: Solder Paste in Electronics Packaging. Springer, Dordrecht. https://doi.org/10.1007/978-94-011-6050-6_9

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  • DOI: https://doi.org/10.1007/978-94-011-6050-6_9

  • Publisher Name: Springer, Dordrecht

  • Print ISBN: 978-94-011-6052-0

  • Online ISBN: 978-94-011-6050-6

  • eBook Packages: Springer Book Archive

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