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Hot Deformation Behavior of the 20 vol.% TiC/Cu-Al2O3 Composites

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Abstract

Hot deformation behavior of the 20 vol.% TiC/Cu-Al2O3 composite was studied using the Gleeble-1500D thermo-mechanical simulator with various strain rates at different deformation temperatures. The softening mechanism due to dynamic recrystallization was a feature of the high-temperature true stress–strain curves. The peak stress increased at the lower deformation temperature and the higher strain rate. Microstructure evolution was explored. Thermal deformation activation energy was calculated as 218.9 kJ/mol, and the constitutive equation was established. The processing map was constructed to obtain optimal processing domain of 700-850 °C and 0.001-0.04 s−1 for hot working.

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Acknowledgments

This work was supported by the Science and Technology Open Cooperation Fund of the Henan Province. The authors are grateful to Prof. Zhou Xudong for his assistance with the experiment. AV acknowledges support from the National Science Foundation (IRES 1358088).

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Authors and Affiliations

  1. School of Material Science and Engineering, Henan University of Science and Technology, Luoyang, 471023, China

    Yong Liu, Zhiqiang Yang, Baohong Tian & Yi Zhang

  2. Collaborative Innovation Center of Nonferrous Metals, Luoyang, 471023, Henan Province, China

    Yong Liu & Yi Zhang

  3. Henan Key Laboratory of Advanced Non-Ferrous Materials, Luoyang, 471023, China

    Yong Liu & Baohong Tian

  4. National Laboratory of Solid State Microstructures and Department of Materials Science and Engineering, College of Engineering and Applied Sciences, Nanjing University, Nanjing, 210093, China

    Zhengbin Gu

  5. Department of Mechanical Engineering, University of South Florida, Tampa, 33620, USA

    Alex A. Volinsky

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  1. Yong Liu
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  2. Zhiqiang Yang
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  3. Baohong Tian
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  4. Yi Zhang
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Correspondence to Yong Liu or Alex A. Volinsky.

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Liu, Y., Yang, Z., Tian, B. et al. Hot Deformation Behavior of the 20 vol.% TiC/Cu-Al2O3 Composites. J. of Materi Eng and Perform 27, 4791–4798 (2018). https://doi.org/10.1007/s11665-018-3586-1

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  • DOI: https://doi.org/10.1007/s11665-018-3586-1

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