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Low-cycle fatigue behavior and mechanisms of a lead-free solder 96.5Sn/3.5Ag

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Abstract

Low-cycle fatigue tests of as-cast Sn-Ag eutectic solder (96.5Sn/3.5Ag) were performed using a noncontact strain controlled system at 20°C. The fatigue behavior followed the Coffin-Manson equation with a fatigue-ductility exponent of 0.76. Without local deformation and stress concentration at contact points between the extensometer and the specimen surface in strain-controlled fatigue tests, crack initiation and propagation behavior was observed on the specimen surface using a replication technique. After failure, the longitudinal cross sections were also examined using scanning electron microscopy (SEM). Microcracks initiated from steps at the boundary between the Sn-dendrite and the Sn-Ag eutectic structure and cavities along the boundaries especially around the Ag3Sn particles. Stage II crack propagated in mixed manner with intergranular cracks along the Sn-dendrite boundaries and transgranular cracks through the Sn-dendrites and the Sn-Ag eutectic structure. Propagation of stage II cracks could be expressed by the relation of dac/dN = 4.7 × 10−11[ΔJ]1.5, where ac is the average crack length and ΔJ is the J-integral range. After fatigue tests, small grains were observed in Sn-dendrites near the fracture surface.

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Authors and Affiliations

  1. Department of Mechanical Engineering, Nagaoka University of Technology, 1603-1 Kamitomioka, 940-2188, Nagaoka, Japan

    Chaosuan Kanchanomai, Yukio Miyashita & Yoshiharu Mutoh

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  1. Chaosuan Kanchanomai
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  2. Yukio Miyashita
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  3. Yoshiharu Mutoh
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Kanchanomai, C., Miyashita, Y. & Mutoh, Y. Low-cycle fatigue behavior and mechanisms of a lead-free solder 96.5Sn/3.5Ag. J. Electron. Mater. 31, 142–151 (2002). https://doi.org/10.1007/s11664-002-0161-0

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  • DOI: https://doi.org/10.1007/s11664-002-0161-0

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