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Submicron nickel filaments made by electroplating carbon filaments as a new filler material for electromagnetic interference shielding

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Abstract

Short nickel filaments of diam 0.4 μm and containing 94 vol% Ni and 6 vol% C were fabricated by electroplating with nickel 0.1 μm diam catalytically grown carbon filaments. The use of these filaments in polyether sulfone in amounts of 3, 7,13, and 19 vol% gave composites with electromagnetic interference shielding effectiveness at 1–2 GHz of 42,87,84, and 92 dB, respectively, compared to a value of 90 dB for solid copper. Less shielding was attained when 0.1 μm diam carbon filaments or 2 or 20 μm diam nickel fibers were used instead.

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Authors and Affiliations

  1. Composite Materials Research Laboratory, Furnas Hall, State University of New York at Buffalo, 14260-4400, Buffalo, NY

    Xiaoping Shui & D. D. L. Chung

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  1. Xiaoping Shui
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  2. D. D. L. Chung
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Shui, X., Chung, D.D.L. Submicron nickel filaments made by electroplating carbon filaments as a new filler material for electromagnetic interference shielding. J. Electron. Mater. 24, 107–113 (1995). https://doi.org/10.1007/BF02659630

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  • DOI: https://doi.org/10.1007/BF02659630

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