The Influence of Impurity Content on Thermal Stability of Low Stacking Fault Energy Silver Processed by Severe Plastic Deformation

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Abstract:

The effect of the impurity content on the evolution of the ultrafine-grained (UFG) microstructure in low stacking fault energy Ag and its stability at room and elevated temperatures were investigated. Samples of silver having high (99.995%) and somewhat lower (99.99%) purity levels were processed by equal-channel angular pressing (ECAP) at room temperature (RT) up to 16 passes. Although, the minimum grain size achieved by ECAP was ~200 nm for both series, the lattice defect structure was strongly influenced by the impurity content. In the samples processed by 4-16 passes of ECAP a self-annealing occurred during storage RT that was promoted by the higher twin boundary frequency. Both room-and high-temperature thermal stability of 99.99% purity Ag were much better due to the pinning effect of impurities. It was found that a large number of dislocation loops remained in the microstructure even after recrystallization at high temperatures.

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222-227

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November 2012

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