Chloride-Based CVD of 4H-SiC at High Growth Rates on Substrates with Different Off-Angles

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Abstract:

A review of recently achieved results with the chloride-based CVD on 8° and 4° off axis and nominally on-axis 4H-SiC wafers is done to clarify the epitaxial growth mechanisms on different off-angle substrates. The process conditions selected for each off-axis angle become even more difficult when running at growth rates of 100 µm/h or more. A fine-tuning of process parameters mainly temperature, C/Si ratio and in situ surface preparation is necessary for each off-angle. Some trends related to the surface properties and the effective C/Si ratio existing on the surface prior to and during the epitaxial growth can be observed.

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Periodical:

Materials Science Forum (Volumes 717-720)

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113-116

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Online since:

May 2012

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