MD Simulations of Nanomachining Monocrystalline Silicon

Guo Kun Qu

doi:10.4028/www.scientific.net/KEM.667.108

Paper Titles

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Light Scattering of HDPE and LDPE in Laser Transmission Welding
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MD Simulation and Optimization Analysis for Nanoscale Material Removal Process
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MD Simulations of Nanomachining Monocrystalline Silicon
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Optimization Design of Diamond Circular Saw-Blade with Discontinuous Cutting and Uneven Distribution for Cutting Thin-Walled Tubes
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Research and Modeling of Blades with Complex Surfaces Based on Laser Rapid Prototyping
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Test and Analysis of Electric Arc Machining Characteristics of Titanium Alloy and High-Temperature Alloy
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Research on Surface Quality for CBN Grinding Wheel Based on “Speed Effect”
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HomeKey Engineering MaterialsKey Engineering Materials Vol. 667MD Simulations of Nanomachining Monocrystalline...

MD Simulations of Nanomachining Monocrystalline Silicon

Abstract:

Molecular dynamics (MD) simulations of nanomachining of monocrystalline silicon were performed with the aid of Tersoff potential. The effects of machining conditions on the nature of heat distribution and corresponding phase transformation during nanomachining were investigated. It is clearly demonstrated that heat distribution shows a roughly concentric shape around the shear zone. A steep temperature gradient is observed in diamond tool and the highest temperature lies in chip. Stress distribution presents dual annular shapes, the highest compressive stress and tensile stress lay in shear zone and machined surface, respectively. Phase transformation mainly occurred in chips, shear zone and machined surface. Additionally, atoms in the machined surface are transformed from diamond cubic structure (Si-I) to β-tin structure (Si-II) and bct5-Si.

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Periodical:

Key Engineering Materials (Volume 667)

Pages:

108-113

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.667.108

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Online since:

October 2015

Authors:

Guo Kun Qu*

Keywords:

Heat Distribution, Material Removal, Molecular Dynamics, Phase Transformation

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