Electro-Thermal Design of Smart Power Devices and Integrated Circuits

Konstantin O. Petrosyants; Igor A. Kharitonov; Nikita I. Ryabov

doi:10.4028/www.scientific.net/AMR.918.191

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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 918Electro-Thermal Design of Smart Power Devices and...

Electro-Thermal Design of Smart Power Devices and Integrated Circuits

Abstract:

An efficient methodology of electro-thermal design of smart power semiconductor devices and ICs, based on the combined use of SPICE circuit analysis tool and software tools for 2D/3D thermal simulation of IC chip construction, is presented. The features of low, medium and high power elements, temperature sensors, IC chips simulation are considered.

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Periodical:

Advanced Materials Research (Volume 918)

Pages:

191-194

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.918.191

Citation:

Cite this paper

Online since:

April 2014

Authors:

Konstantin O. Petrosyants*, Igor A. Kharitonov, Nikita I. Ryabov

Keywords:

Bipolar Junction Transistor (BJT), Electro-Thermal Design, Integrated Circuits, IR Camera, MOSFET, Smart Power Devices, SPICE Models, Temperature Sensors, Thermal Simulation

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* - Corresponding Author

References

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