The Research of Spraying SiC/Cu Electronic Packaging Composites

Ming Hu; Jing Gao; Yun Long Zhang

doi:10.4028/www.scientific.net/AMR.284-286.620

Paper Titles

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Friction Properties of Carbon Nanotubes Reinforced Nitrile Composites under Water Lubricated Condition
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Microwave Modified Timber: Collaborative Research Integrating Product Design for New Materials Development
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The Research of Spraying SiC/Cu Electronic Packaging Composites
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Properties of Waterborne Polyurethanes: Effect of NCO/OH Ratio
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Composite Behavior of Concrete Slab with Steel Decking under Flexural Loading
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Numerical Simulation Research of Flexible Shield Support Lateral Caving Technology
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Effect of TiO₂ on Mechanical Properties and Microstructure of Magnesium Aluminate Spinel Refractories
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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 284-286The Research of Spraying SiC/Cu Electronic...

The Research of Spraying SiC/Cu Electronic Packaging Composites

Abstract:

The SiC/Cu electronic packaging composites with excellent performance were successfully prepared by the chemical plating copper on the surface of SiC powders and high-speed flame spraying technology. The results showed that the homogeneous dense coated layers can be obtained on the surface of SiC powder by optimizing process parameters. The volume fraction of SiC powders in the composites could significantly increase and figure was beyond 55vol% after spraying Copper. The SiC and Cu were the main phases in the spraying SiC/Cu electronic packaging composite, at the same time Cu₂O can be tested as the trace phase. The interface combination properties of SiC/Cu in the hot-pressed samples can obviously improve. The thermal expansion coefficient and thermal conductivity of SiC/Cu electronic packaging composite basic can satisfy the requirements for electronic packaging materials.