Comparisons on Flow and Temperature Fields for Water-Collecting Box of Diesel Exhaust System
p.1532
p.1532
The Optimal Structural Parameters of Embedded High-Power Microwave Components Based on RSM-GA
p.1537
p.1537
Characteristic and Forecast of the Error Cell on Machine Tool
p.1541
p.1541
Dynamic Thermal Equilibrium Test and Analysis of the Small Gasoline Engine
p.1545
p.1545
Thermal Design and Analysis of a Satellite Borne Electronic PCB
p.1551
p.1551
Study on Kinematics Simulation of 3-TPT Parallel Machine Tool Based on Pro/E
p.1555
p.1555
Three Point Suspension Converter's Mechanical System and Elastic Friction Vibration Principle Analysis
p.1560
p.1560
Macro-TG Reactor and Thermogravimetric Analysis for Cooking Oil Tar Samples
p.1569
p.1569
Experimental Investigation on Flow Boiling in Micro-Channel with R32/R134a
p.1574
p.1574
Thermal Design and Analysis of a Satellite Borne Electronic PCB
Abstract:
Thermal design, finite element analysis of a satellite borne PCB is introduced in this paper. Some methods were adopted to help heat conduct and a simplified computing model was built. The analysis results show that the temperature scope of the main structure is from 45.5°C to 72.3°C in high temperature work case and all of junction temperatures of components are lower than the derated maximum junction temperatures themselves and leave enough design margins, which match the requirements of thermal analysis.
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Info:
Periodical:
Advanced Materials Research (Volumes 199-200)
Pages:
1551-1554
Citation:
Online since:
February 2011
Authors:
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