A Service Component Model for Semiconductor Test Equipment

Hwa Young Jeong; Yoon Ho Kim

doi:10.4028/www.scientific.net/AMM.157-158.1591

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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vols. 157-158A Service Component Model for Semiconductor Test...

A Service Component Model for Semiconductor Test Equipment

Abstract:

Web service is a trend of new technology that it is able to support function to user over the internet. That is, user can operate and process the system, and set up values to the machine using the internet at the distance location. User doesn’t have to have any database for their works in the web service environment. Therefore, the development method has changing from traditional process, it needs mechanical parts with stand-only computer and no network, to service based system with network. In this paper, we propose a service component model for semiconductor test equipment, IC test handler. This model constructs to compose the software component, business logic, as a service.

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Periodical:

Applied Mechanics and Materials (Volumes 157-158)

Pages:

1591-1594

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.157-158.1591

Citation:

Cite this paper

Online since:

February 2012

Authors:

Hwa Young Jeong, Yoon Ho Kim

Keywords:

Manufacturing System, Semiconductor Test Equipment, Service Component, Web Service

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